Intel Track



Up Squared, Intel FPGA DE board

Participants may use one of the following types of boards.

Up Squared board is the most powerful maker board ever! Now it is also available as a fanless PC, powered by Intel Apollo Lake CPU.

DE1-SoC board is an updated DE1 board. It is useful for learning about digital logic, computer organization, and FPGAs. Featuring a Cyclone® V 5CSEMA5 FPGA which has an integrated dual-core ARM Cortex-A9. The DE1-SoC board is designed for university and college use. It is suitable for a wide range of university projects, from simple tasks to advanced designs.


Participants can choose one of the following sub-tracks to participate in Intel Track.

 Intel FPGA Track

The Intel FPGA track offers the opportunity for students to create their projects and implement in the Intel FPGA development kits. The projects can target various market segments, e.g. consumer, industrial, medical, automotive, military, computing, ASIC emulation, etc., with the emphasis on creativity, innovation, practicality, and potential for commercialization of the projects.

Students who are more well-verse in hardware description language can choose to use Verilog, VHDL, etc. to create their designs. Students who prefer software programming language like C can use the Nios II soft processor, or the hard processor system available in the Intel SoC FPGA devices. A wide range of IP cores are also available for students to utilize and instantiate in their designs, saving them precious time and accelerating their design development.

The eventual designs are expected to be implemented in Intel FPGA development kits for prototyping or proof of concept. Students can choose to use the Cyclone V DE1 SoC development kits or other Intel FPGA development kits as preferred.

 Intel IoT & Visual Sensing Track

Over 80 billion connected devices worldwide is expected by 2025 which will yield to the generation of 180 trillion gigabytes of new data. The visual data produced by the visual sensors at the edge that contains rich amount of information become increasingly important to derive actionable insights across various segments like smart retails, smart cities, automated manufacturing, and autonomous vehicles globally, and has established the term called “the Internet-of-Video-Things” (IoVT). This track is focusing on any of the Internet-of-Things (IoT) edge-to-cloud use cases particularly Visual Sensing solutions.

More information on the focus areas can be obtained from:

The Internet of Things Starts with Intel Inside

The AAEON Up Squared board is provided, which is based on the latest Intel Atom Apollo Lake SoC. It is currently touted as the fastest x86 maker board which contains rich graphics and high performance media engine.

 Intel Artificial Intelligence (AI) Track

The world is changing rapidly and innovations are shaping it. Artificial Intelligence (AI) is one of these innovations that significantly transform our world and society. Intel AI Track envisions the participants to be part of the revolution! Solve the problem with AI-technologies to make the difference and shape the future. The solution can be applied, but not limited to retail, health care, smart city, manufacturing, sports, and autonomous vehicles.

Participants should demonstrate innovations and creativity to define solution by using the AAEON Up Squared board which is based on the latest Intel Atom Apollo Lake SoC. It is currently touted as the fastest x86 maker board which contains rich graphics and high performance media engine.


UP Squared

Type Single board Computer
Carrier board Not required
Dimension 86.5mm x 90mm
CPU N3350 (2C) up to 2.4GHz
Instruction set 64 bit
Core 2 Core (Celeron)
RAM 4GB
Storage 32GB eMMC
USB 2.0 2
USB 3.0 4 (incl. 1x OTG)
Expansion 40-pin GP-bus
60-pin EXHAT
mini-PCIe(SATA)
M2. 2230 E key
SATA3 1
On-board video output 1x HDMI + 1x DP
1x eDP
Connectivity 2x GbLAN
MIPI-CSI 1x 2 lane
1x 4 lane
Graphic Intel Gen 9 HD 500/HD 505
OS Support Windows 10 full, Windows IoT Core, Yocto, Ubuntu, Ubilinux, Android 6.0
DC in 5V@6A
Operating temperature 32 to 140°F (0 to 60°C)

DE1-SoC

  • FPGA
    • Cyclone V SoC 5CSEMA5F31 (85k logic elements)
    • Dual-core ARM Cortex-A9 (HPS)
    • EPCQ256 256-Mbit serial configuration device
  • I/O Devices
    • Built-in USB-Blaster for FPGA configuration
    • Line In/Out, Microphone In (24-bit Audio CODEC)
    • Video Out (VGA 24-bit DAC)
    • Video In (NTSC/PAL/Multi-format)
    • Infrared port
    • 10/100/1000 Ethernet
    • Two Port USB 2.0 Host (Type A)
    • PS/2 dual mouse and keyboard port
    • Line-in, Line-out, microphone-in (24-bit audio CODEC)
    • Expansion headers (two 40-pin headers)
  • Memory
    • 1GB DDR3 SDRAM (HPS)
    • Two Port USB 2.0 Host (Type A)

    • 64 MB SDRAM (FPGA)
    • Micro SD memory card slot
  • Other Devices
    • Six 7-segment displays
    • 10 toggle switches
    • 10 LEDs
    • Four debounced pushbutton switches
    • 50 MHz clock (x4)